VIA partners with Rutronik to expand edge AI solutions

Ryan Daws is a senior editor at TechForge Media with over a decade of experience in crafting compelling narratives and making complex topics accessible. His articles and interviews with industry leaders have earned him recognition as a key influencer by organisations like Onalytica. Under his leadership, publications have been praised by analyst firms such as Forrester for their excellence and performance. Connect with him on X (@gadget_ry) or Mastodon (

VIA Technologies is partnering with Rutronik to bring advanced IoT, edge AI, and computer vision technologies to a broader customer base, particularly in the industrial, retail, and commercial sectors.

The partnership comes at a time when edge computing is gaining traction across various industries, driven by the need for real-time data processing and reduced latency in IoT applications. VIA’s intelligent edge solutions, powered by MediaTek Genio processors, offer a comprehensive range of platforms designed to meet diverse use cases.

Anja Schaal, Senior Manager Product Marketing Boards & Storage at Rutronik, said:, “VIA’s intelligent edge solutions provide a broad selection of highly-integrated modules, boards, starter kits, and systems that accelerate time-to-market for innovative industrial, retail, and commercial Edge AI devices.

“Partnering with VIA opens up the opportunity to offer our customers all of Mediatek’s design-level solutions – from chip-level design to modules and even full highly integrated system designs.”

VIA’s product portfolio includes system-on-modules, single board computers, and edge AI systems available in various form factors such as SOM, Mini-ITX, and Pico-ITX. These solutions come with guaranteed longevity to support extended product lifecycles – a crucial factor for industrial IoT deployments.

To simplify system development for Arm-based platforms, VIA provides Android and Linux board support packages and software evaluation kits. The company also offers flexible hardware and software customisation services, aimed at accelerating time-to-market and minimising development costs for its customers.

Epan Wu, General Manager at VIA Intelligent Solutions, commented: “We enable enterprises to transform the efficiency, and sustainability of their operations by combining advanced edge AI, computer vision, and cloud technologies with powerful and reliable systems and devices.”

Wu also expressed enthusiasm about the partnership with Rutronik, noting their “deep understanding of design-in processes but also insights along the entire product life cycle.”

This collaboration is expected to strengthen VIA’s position in the European market, leveraging Rutronik’s extensive experience and global network. As edge computing continues to evolve, partnerships like this are likely to play a crucial role in driving innovation and adoption across various industries.

The move also reflects the growing importance of edge AI in IoT deployments, as businesses seek to process data closer to the source, reduce bandwidth usage, and improve response times.

Collaborations between hardware providers like VIA and distribution partners such as Rutronik will be instrumental in bringing advanced edge computing solutions to a wider audience, potentially accelerating the digital transformation of industries across Europe and beyond.

(Image Credit: VIA Technologies)

See also: Lee House, IoT83: Exploring the state of IoT applications across industries

Want to learn about the IoT from industry leaders? Check out IoT Tech Expo taking place in Amsterdam, California, and London. The comprehensive event is co-located with other leading events including Cyber Security & Cloud Expo, AI & Big Data Expo, Intelligent Automation Conference, Edge Computing Expo, and Digital Transformation Week.

Explore other upcoming enterprise technology events and webinars powered by TechForge here.

Tags: , , , , , , ,

View Comments
Leave a comment

Leave a Reply

Your email address will not be published. Required fields are marked *